This equipment utilizes a rotating abrasive wheel to smooth and refine the surface of semiconductor wafers. This process is crucial for preparing the wafers for subsequent fabrication steps, such as photolithography and deposition. An example application is the removal of microscopic imperfections or damage from the wafer surface following slicing or grinding.
Precision surface finishing is essential in semiconductor manufacturing, influencing the performance, reliability, and yield of integrated circuits. By ensuring a uniform and defect-free surface, this technology contributes to the production of high-quality semiconductor devices. Historically, advancements in this field have been driven by the demand for increasingly complex and miniaturized electronics. This has led to continuous improvements in the precision and efficiency of these machines, enabling the fabrication of advanced microchips.
